Page last modified 18:31, 7 Mar 2014 by jsousa
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Baking de componentes
Baking de PCB a 100º durante >8 horas
Baking de BGA a 100º durante >24 horas
Processo de soldadura
Reflow das BGAs somente até 245º
Limpeza de PCBs
Lavar com alcool isopropílico abundantement os PCBs já montados
Lavar com despuma e líquido de limpeza
Comprar uma tina de ultrasons grande
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