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Page last modified 18:31, 7 Mar 2014 by jsousa
IPFN > CODAC > IPFN Instrumentation > Production Guidelines > GUIDELINES > Board Assembling
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Board Assembling

    TOC 

    1. 1. Baking de componentes
    2. 2. Processo de soldadura
    3. 3. Limpeza de PCBs

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    Baking de componentes

    Baking de PCB a 100º durante  >8 horas
    Baking de BGA a 100º durante >24 horas

    Processo de soldadura

    Reflow das BGAs somente até 245º

    Limpeza de PCBs

    Lavar com alcool isopropílico abundantement os PCBs já montados

    Lavar com despuma e líquido de limpeza

    Comprar uma tina de ultrasons grande
     

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